06/09/2026
CEMWorks recently presented at ECTC 2026 in Orlando on BEM-Based Characterization of a D-Band On-Chip Patch Antenna Array.
The paper explores how contactless over-the-air measurement can be combined with Boundary Element Method simulation to better characterize on-chip antennas above 100 GHz.
This matters because on-chip and in-package antennas are becoming increasingly important for next-generation wireless, sensing, and high-frequency electronic systems. But as antennas move closer to chips and packages, both measurement and simulation become more challenging.
By cross-validating contactless measurements with BEM simulation, the work demonstrates a practical path toward more accurate and scalable design workflows for D-band antenna arrays.
Read more here: https://wpg.d56.myftpupload.com/cemworks-presents-d-band-on-chip-antenna-research-at-ectc-2026-2/